Interdisciplinary Thermal Fluid System Analysis
- PCB Thermal Management
- Boiler Blowdown - Steam (Water) Hammer Phenomena
- Automobile Passenger Seat Cooled by Convection and Conduction Heat Transfer Mode
- Printed Circuit Boards (PCBs) Thermal Management - Development of Closed-Form Solutions: (i) Forced and Natural Conection Cooling, (ii) Effect of Air Flow Rate and Chip Location on Maximum PCB Wall Temperature, (iii) Unheated Starting Length and (iv) Dimensionless Temperature and Temperature Influence Factor (TIF)
- PCB CFD Modeling for Heat transfer and Fluid Flow Characteristics - (i) Forced and Natural Convection Cooling and (ii) In-line and Staggered Arrangements of HEated PCB Chips
- Development of PCB Thermal Design Guideline Software - (i) Forced and Natural Convection Cooling and (ii) Prediction of PCB Peal Temperature with Various Design Parameters - PCB Dimensions / Chip Size, Number, Location and Heat Amount / Air Flow Rate and Temperature, etc.
- Development of Semi-Analytical PCB Thermal Design Process Software - (i) Analytical Theory Integrated with Experimental Results (Infrared Thermal Imaging System) and (ii) Prediction of PCB Wall (Axial and Lateral) Temperature Distributions with Various Design and Operating Conditions
- Investigation of Steam (Water) Hammer Phenomena During Boiler Vessel Blowdown Process - Theoretical Verification of the Critical Phenomena - The Effect of Boiler Pressure on the Magnitude and Velocity of Pressure Pulse
- Automobile Passenger Seat Cooled by Convection and Conduction Heat Transfer Mode - Developing Analytical and Numerical (CFD) Models to Predict Vehicle Seat Surface Temperature and to Assess the Corresponding Passenger Thermal Comfort and Pleasureness
For more information, contact:
Dr. Hyunjae Park
Director and Research Associate Professor
Thermofluid Science and Energy Research Center (TSERC)
Department of Mechanical and Industrial Engineering
College of Engineering
Marquette University
P.O. Box 1881
Milwaukee, Wisconsin 53201-1881
Phone: (414) 288-6716
FAX: (414) 288-7790
E-mail
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